Clean, compact, and secure transport solution for semiconductor wafers. Combines particle control, ergonomic handling, and cleanroom compatibility for efficient wafer logistics.

High-protection transport and storage solution for semiconductor wafers. Combines mechanical safety, optimized density, and ESD performance for cleanroom-compliant wafer logistics.

Next-generation patterning materials for ultra-high resolution MicroLED display technology. Delivering exceptional color purity, quantum efficiency, and Cd-free scalability for future displays.

High-performance polyimide film for flexible electronics and next-generation displays. Delivers unmatched thermal and dimensional stability for demanding optical and sensor applications.

Precision patterning material for advanced lithographic applications. Enables high-resolution imaging in semiconductor and MEMS fabrication using negative-tone photoresist films.

Advanced encapsulation resin for demanding electronic applications. Provides thermal, chemical, and mechanical protection for EV, industrial, and renewable systems.

Fast-curing adhesives for thermal and electronic performance. We support high-reliability bonding solutions for motors, sensors, and thermal modules in next-gen automotive systems.

Sustainable high-performance systems for structural bonding and FRP composites. Two-component and single-component formulations for industrial use.

Reinforcement and stress relief for advanced semiconductor packaging. Ideal for flip-chip, BGA, and high-reliability applications in microelectronics.

High-performance thermoset compound for electronic encapsulation. Enables robust protection of ICs, sensors, and power devices in semiconductor packaging.

Advanced encapsulation materials for semiconductors and electronic components. Ideal for ICs, sensors, MEMS, and power devices in demanding packaging applications.

Ultra-high purity metal-organic precursor for ALD and MOCVD. Enables precise deposition of Al₂O₃ and compound semiconductors in photovoltaic and microelectronic industries.

High-purity phosphorus precursor for PSG and BPSG layer formation. Enables controlled doping and dielectric deposition in advanced semiconductor manufacturing.

High-purity phosphorus ester for PSG and BPSG deposition. Enables precise dielectric layering in wafer fabrication and microelectronics production.

High-purity boron compound for advanced BPSG deposition. Enables clean doping and dielectric layering in wafer processing and MEMS production.

High-purity phosphorus ester for PSG & BPSG deposition. Enables precise dielectric layering in advanced semiconductor manufacturing.

High-purity boron ester for advanced chemical applications. Nagase supplies triethyl borate (TEB) used in organic synthesis, cross-coupling reactions, and specialty solvent systems where boron precision is essential.

High-purity solvent for efficient surface treatment. Nagase delivers trans-1,2-dichloroethylene (DCE) used in polymer production, metal degreasing, and electronics cleaning where performance and purity are critical.

Reliable performance for next-generation semiconductor fabrication. Nagase's high-purity TEOS ensures optimal film quality, consistency, and reliability across a wide range of deposition environments.

High-purity phosphorus for safety and innovation. Nagase delivers red phosphorus in electronic and industrial grades for flame retardants, semiconductor doping, and specialized materials.

Powerful dehydration meets phosphorus chemistry. Nagase supplies high-purity P₂O₅ for use in electronics, fine chemical synthesis, and phosphorus-based compound production.

Reliable reactivity for high-tech manufacturing. Nagase offers POCl₃ in electronic and industrial grades for diffusion doping, phosphorylation reactions, and advanced chemical processes.

Reliable performance for sensitive chemical processes. Nagase supplies high-purity boron tribromide (BBr₃) for advanced synthesis, demethylation, and semiconductor applications.

Nagase’s advanced adhesives combine strong bonding with optimal heat dissipation. Designed for power electronics, LEDs, and thermal-critical assemblies.

Reliable bonding meets precise conductivity. Nagase offers cutting-edge adhesive solutions tailored for modern electronic components and assemblies.