Electronics Solutions – Materials, Components & Technologies
Innovative co-development and engineering solutions across electronics and semiconductor industries.
From advanced materials to integrated support systems – we drive the technologies of tomorrow.
Versatile chemical expertise for modern applications
At Nagase, we deliver engineering-driven solutions for the electronics industry, enabling our customers to address complex challenges and accelerate product innovation. Through a customer-centric approach, we support every step of the value chain – from R&D and design to mass production. Our cross-functional teams work closely with clients to develop tailored process materials, equipment, and integrated solutions for semiconductors and electronic devices. Whether you’re scaling cutting-edge production or fine-tuning precision components, Nagase offers the expertise and resources power innovations across industries including electrical, electronics, semiconductors, mobility, optics, displays, environmental, and energy. Our solutions help optimize performance, durability, and efficiency across various production processes. Whether you’re developing cutting-edge technologies or improving existing ones– our products meet the highest quality and purity standards. Nagase is a custom formulator that designs and formulates unique products to meet their customers requirements.
Key Advantages of Nagase Electronics:
- Engineering Excellence – Deep technical know-how for high-precision applications
- Collaborative Development – Joint innovation for customized high-tech solutions
- End-to-End Support – From initial concept to full-scale production
- Advanced Process Materials – For semiconductors, electronic devices, and more
- Global Network – Localized service with international reach and supply chains
Discover our wide range of innovative solutions for advanced material applications. Explore our product categories below.
Specialty Materials & Components for Semiconductor and Electronic Device Production
Adhesives for Solar and Semiconductor Applications
Thermally Conductive Adhesive
Nagase’s advanced adhesives combine strong bonding with optimal heat dissipation. Designed for power electronics, LEDs, and thermal-critical assemblies.
Electrically Conductive Adhesive
Reliable bonding meets precise conductivity. Nagase offers cutting-edge adhesive solutions tailored for modern electronic components and assemblies.
Advanced Material for Semiconductor Doping Material
Boron Tribromide
Reliable performance for sensitive chemical processes. Nagase supplies high-purity boron tribromide (BBr₃) for advanced synthesis, demethylation, and semiconductor applications.
Phosphorus Oxychloride (POCl3)
Reliable reactivity for high-tech manufacturing. Nagase offers POCl₃ in electronic and industrial grades for diffusion doping, phosphorylation reactions, and advanced chemical processes.
Phosphorus Pentoxide
Powerful dehydration meets phosphorus chemistry. Nagase supplies high-purity P₂O₅ for use in electronics, fine chemical synthesis, and phosphorus-based compound production.
Red Phosphorus
High-purity phosphorus for safety and innovation. Nagase delivers red phosphorus in electronic and industrial grades for flame retardants, semiconductor doping, and specialized materials.
Tetraethyl Orthosilicate (TEOS)
Reliable performance for next-generation semiconductor fabrication. Nagase's high-purity TEOS ensures optimal film quality, consistency, and reliability across a wide range of deposition environments.
Trans-1,2-Dichloroethylene (DCE)
High-purity solvent for efficient surface treatment. Nagase delivers trans-1,2-dichloroethylene (DCE) used in polymer production, metal degreasing, and electronics cleaning where performance and purity are critical.
Triethyl Borate (TEB)
High-purity boron ester for advanced chemical applications. Nagase supplies triethyl borate (TEB) used in organic synthesis, cross-coupling reactions, and specialty solvent systems where boron precision is essential.
Triethyl Phosphate (TEPO)
High-purity phosphorus ester for PSG & BPSG deposition. Enables precise dielectric layering in advanced semiconductor manufacturing.
Trimethyl Borate (TMB)
High-purity boron compound for advanced BPSG deposition. Enables clean doping and dielectric layering in wafer processing and MEMS production.
Trimethyl Phosphate (TMPO)
High-purity phosphorus ester for PSG and BPSG deposition. Enables precise dielectric layering in wafer fabrication and microelectronics production.
Trimethyl Phosphite (TMP)
High-purity phosphorus precursor for PSG and BPSG layer formation. Enables controlled doping and dielectric deposition in advanced semiconductor manufacturing.
Trimethylaluminum (TMA)
Ultra-high purity metal-organic precursor for ALD and MOCVD. Enables precise deposition of Al₂O₃ and compound semiconductors in photovoltaic and microelectronic industries.
Advanced Material for Semiconductor Packaging Material
Advanced Sheet Molding Compound (a-SMC)
High-performance thermoset compound for electronic encapsulation. Enables robust protection of ICs, sensors, and power devices in semiconductor packaging.
Liquid Molding Compound (LMC)
Advanced encapsulation materials for semiconductors and electronic components. Ideal for ICs, sensors, MEMS, and power devices in demanding packaging applications.
Underfill Materials for Flip-Chip & BGA Packaging
Reinforcement and stress relief for advanced semiconductor packaging. Ideal for flip-chip, BGA, and high-reliability applications in microelectronics.
Bio-Based Epoxy
Bio-Based Formulated Epoxy Resin
Sustainable high-performance systems for structural bonding and FRP composites. Two-component and single-component formulations for industrial use.
Materials for Automotive Electronics & Power devices
Epoxy Potting
Advanced encapsulation resin for demanding electronic applications. Provides thermal, chemical, and mechanical protection for EV, industrial, and renewable systems.
Magnet Bonding Adhesives
Fast-curing adhesives for thermal and electronic performance. We support high-reliability bonding solutions for motors, sensors, and thermal modules in next-gen automotive systems.
Photolithography Processing Materials
High Resolution Dry Film Photoresist Negative Tone
Precision patterning material for advanced lithographic applications. Enables high-resolution imaging in semiconductor and MEMS fabrication using negative-tone photoresist films.
Polyimide Film
Polyimide Film (Xenomax®)
High-performance polyimide film for flexible electronics and next-generation displays. Delivers unmatched thermal and dimensional stability for demanding optical and sensor applications.
Quantum Dots Materials
Quantum Dots Materials
Next-generation patterning materials for ultra-high resolution MicroLED display technology. Delivering exceptional color purity, quantum efficiency, and Cd-free scalability for future displays.
Wafer Shipper
Horizontal Wafer Shipper
High-protection transport and storage solution for semiconductor wafers. Combines mechanical safety, optimized density, and ESD performance for cleanroom-compliant wafer logistics.
Vertical Wafer Shipper
Clean, compact, and secure transport solution for semiconductor wafers. Combines particle control, ergonomic handling, and cleanroom compatibility for efficient wafer logistics.
Versatile chemical expertise for modern applications
At Nagase, we deliver engineering-driven solutions for the electronics industry, enabling our customers to address complex challenges and accelerate product innovation. Through a customer-centric approach, we support every step of the value chain – from R&D and design to mass production. Our cross-functional teams work closely with clients to develop tailored process materials, equipment, and integrated solutions for semiconductors and electronic devices. Whether you’re scaling cutting-edge production or fine-tuning precision components, Nagase offers the expertise and resources power innovations across industries including electrical, electronics, semiconductors, mobility, optics, displays, environmental, and energy. Our solutions help optimize performance, durability, and efficiency across various production processes. Whether you’re developing cutting-edge technologies or improving existing ones– our products meet the highest quality and purity standards. Nagase is a custom formulator that designs and formulates unique products to meet their customers requirements.
Key Advantages of Nagase Electronics:
- Engineering Excellence – Deep technical know-how for high-precision applications
- Collaborative Development – Joint innovation for customized high-tech solutions
- End-to-End Support – From initial concept to full-scale production
- Advanced Process Materials – For semiconductors, electronic devices, and more
- Global Network – Localized service with international reach and supply chains
Discover our wide range of innovative solutions for advanced material applications. Explore our product categories below.
Specialty Materials & Components for Semiconductor and Electronic Device Production
Adhesives for Solar and Semiconductor Applications
Thermally Conductive Adhesive
Nagase’s advanced adhesives combine strong bonding with optimal heat dissipation. Designed for power electronics, LEDs, and thermal-critical assemblies.
Electrically Conductive Adhesive
Reliable bonding meets precise conductivity. Nagase offers cutting-edge adhesive solutions tailored for modern electronic components and assemblies.
Advanced Material for Semiconductor Doping Material
Boron Tribromide
Reliable performance for sensitive chemical processes. Nagase supplies high-purity boron tribromide (BBr₃) for advanced synthesis, demethylation, and semiconductor applications.
Phosphorus Oxychloride (POCl3)
Reliable reactivity for high-tech manufacturing. Nagase offers POCl₃ in electronic and industrial grades for diffusion doping, phosphorylation reactions, and advanced chemical processes.
Phosphorus Pentoxide
Powerful dehydration meets phosphorus chemistry. Nagase supplies high-purity P₂O₅ for use in electronics, fine chemical synthesis, and phosphorus-based compound production.
Red Phosphorus
High-purity phosphorus for safety and innovation. Nagase delivers red phosphorus in electronic and industrial grades for flame retardants, semiconductor doping, and specialized materials.
Tetraethyl Orthosilicate (TEOS)
Reliable performance for next-generation semiconductor fabrication. Nagase's high-purity TEOS ensures optimal film quality, consistency, and reliability across a wide range of deposition environments.
Trans-1,2-Dichloroethylene (DCE)
High-purity solvent for efficient surface treatment. Nagase delivers trans-1,2-dichloroethylene (DCE) used in polymer production, metal degreasing, and electronics cleaning where performance and purity are critical.
Triethyl Borate (TEB)
High-purity boron ester for advanced chemical applications. Nagase supplies triethyl borate (TEB) used in organic synthesis, cross-coupling reactions, and specialty solvent systems where boron precision is essential.
Triethyl Phosphate (TEPO)
High-purity phosphorus ester for PSG & BPSG deposition. Enables precise dielectric layering in advanced semiconductor manufacturing.
Trimethyl Borate (TMB)
High-purity boron compound for advanced BPSG deposition. Enables clean doping and dielectric layering in wafer processing and MEMS production.
Trimethyl Phosphate (TMPO)
High-purity phosphorus ester for PSG and BPSG deposition. Enables precise dielectric layering in wafer fabrication and microelectronics production.
Trimethyl Phosphite (TMP)
High-purity phosphorus precursor for PSG and BPSG layer formation. Enables controlled doping and dielectric deposition in advanced semiconductor manufacturing.
Trimethylaluminum (TMA)
Ultra-high purity metal-organic precursor for ALD and MOCVD. Enables precise deposition of Al₂O₃ and compound semiconductors in photovoltaic and microelectronic industries.
Advanced Material for Semiconductor Packaging Material
Advanced Sheet Molding Compound (a-SMC)
High-performance thermoset compound for electronic encapsulation. Enables robust protection of ICs, sensors, and power devices in semiconductor packaging.
Liquid Molding Compound (LMC)
Advanced encapsulation materials for semiconductors and electronic components. Ideal for ICs, sensors, MEMS, and power devices in demanding packaging applications.
Underfill Materials for Flip-Chip & BGA Packaging
Reinforcement and stress relief for advanced semiconductor packaging. Ideal for flip-chip, BGA, and high-reliability applications in microelectronics.
Bio-Based Epoxy
Bio-Based Formulated Epoxy Resin
Sustainable high-performance systems for structural bonding and FRP composites. Two-component and single-component formulations for industrial use.
Materials for Automotive Electronics & Power devices
Epoxy Potting
Advanced encapsulation resin for demanding electronic applications. Provides thermal, chemical, and mechanical protection for EV, industrial, and renewable systems.
Magnet Bonding Adhesives
Fast-curing adhesives for thermal and electronic performance. We support high-reliability bonding solutions for motors, sensors, and thermal modules in next-gen automotive systems.
Photolithography Processing Materials
High Resolution Dry Film Photoresist Negative Tone
Precision patterning material for advanced lithographic applications. Enables high-resolution imaging in semiconductor and MEMS fabrication using negative-tone photoresist films.
Polyimide Film
Polyimide Film (Xenomax®)
High-performance polyimide film for flexible electronics and next-generation displays. Delivers unmatched thermal and dimensional stability for demanding optical and sensor applications.
Quantum Dots Materials
Quantum Dots Materials
Next-generation patterning materials for ultra-high resolution MicroLED display technology. Delivering exceptional color purity, quantum efficiency, and Cd-free scalability for future displays.
Wafer Shipper
Horizontal Wafer Shipper
High-protection transport and storage solution for semiconductor wafers. Combines mechanical safety, optimized density, and ESD performance for cleanroom-compliant wafer logistics.
Vertical Wafer Shipper
Clean, compact, and secure transport solution for semiconductor wafers. Combines particle control, ergonomic handling, and cleanroom compatibility for efficient wafer logistics.
Versatile chemical expertise for modern applications
At Nagase, we deliver engineering-driven solutions for the electronics industry, enabling our customers to address complex challenges and accelerate product innovation. Through a customer-centric approach, we support every step of the value chain – from R&D and design to mass production. Our cross-functional teams work closely with clients to develop tailored process materials, equipment, and integrated solutions for semiconductors and electronic devices. Whether you’re scaling cutting-edge production or fine-tuning precision components, Nagase offers the expertise and resources power innovations across industries including electrical, electronics, semiconductors, mobility, optics, displays, environmental, and energy. Our solutions help optimize performance, durability, and efficiency across various production processes. Whether you’re developing cutting-edge technologies or improving existing ones– our products meet the highest quality and purity standards. Nagase is a custom formulator that designs and formulates unique products to meet their customers requirements.
Key Advantages of Nagase Electronics:
- Engineering Excellence – Deep technical know-how for high-precision applications
- Collaborative Development – Joint innovation for customized high-tech solutions
- End-to-End Support – From initial concept to full-scale production
- Advanced Process Materials – For semiconductors, electronic devices, and more
- Global Network – Localized service with international reach and supply chains
Discover our wide range of innovative solutions for advanced material applications. Explore our product categories below.
Specialty Materials & Components for Semiconductor and Electronic Device Production
Adhesives for Solar and Semiconductor Applications
Thermally Conductive Adhesive
Nagase’s advanced adhesives combine strong bonding with optimal heat dissipation. Designed for power electronics, LEDs, and thermal-critical assemblies.
Electrically Conductive Adhesive
Reliable bonding meets precise conductivity. Nagase offers cutting-edge adhesive solutions tailored for modern electronic components and assemblies.
Advanced Material for Semiconductor Doping Material
Boron Tribromide
Reliable performance for sensitive chemical processes. Nagase supplies high-purity boron tribromide (BBr₃) for advanced synthesis, demethylation, and semiconductor applications.
Phosphorus Oxychloride (POCl3)
Reliable reactivity for high-tech manufacturing. Nagase offers POCl₃ in electronic and industrial grades for diffusion doping, phosphorylation reactions, and advanced chemical processes.
Phosphorus Pentoxide
Powerful dehydration meets phosphorus chemistry. Nagase supplies high-purity P₂O₅ for use in electronics, fine chemical synthesis, and phosphorus-based compound production.
Red Phosphorus
High-purity phosphorus for safety and innovation. Nagase delivers red phosphorus in electronic and industrial grades for flame retardants, semiconductor doping, and specialized materials.
Tetraethyl Orthosilicate (TEOS)
Reliable performance for next-generation semiconductor fabrication. Nagase's high-purity TEOS ensures optimal film quality, consistency, and reliability across a wide range of deposition environments.
Trans-1,2-Dichloroethylene (DCE)
High-purity solvent for efficient surface treatment. Nagase delivers trans-1,2-dichloroethylene (DCE) used in polymer production, metal degreasing, and electronics cleaning where performance and purity are critical.
Triethyl Borate (TEB)
High-purity boron ester for advanced chemical applications. Nagase supplies triethyl borate (TEB) used in organic synthesis, cross-coupling reactions, and specialty solvent systems where boron precision is essential.
Triethyl Phosphate (TEPO)
High-purity phosphorus ester for PSG & BPSG deposition. Enables precise dielectric layering in advanced semiconductor manufacturing.
Trimethyl Borate (TMB)
High-purity boron compound for advanced BPSG deposition. Enables clean doping and dielectric layering in wafer processing and MEMS production.
Trimethyl Phosphate (TMPO)
High-purity phosphorus ester for PSG and BPSG deposition. Enables precise dielectric layering in wafer fabrication and microelectronics production.
Trimethyl Phosphite (TMP)
High-purity phosphorus precursor for PSG and BPSG layer formation. Enables controlled doping and dielectric deposition in advanced semiconductor manufacturing.
Trimethylaluminum (TMA)
Ultra-high purity metal-organic precursor for ALD and MOCVD. Enables precise deposition of Al₂O₃ and compound semiconductors in photovoltaic and microelectronic industries.
Advanced Material for Semiconductor Packaging Material
Advanced Sheet Molding Compound (a-SMC)
High-performance thermoset compound for electronic encapsulation. Enables robust protection of ICs, sensors, and power devices in semiconductor packaging.
Liquid Molding Compound (LMC)
Advanced encapsulation materials for semiconductors and electronic components. Ideal for ICs, sensors, MEMS, and power devices in demanding packaging applications.
Underfill Materials for Flip-Chip & BGA Packaging
Reinforcement and stress relief for advanced semiconductor packaging. Ideal for flip-chip, BGA, and high-reliability applications in microelectronics.
Bio-Based Epoxy
Bio-Based Formulated Epoxy Resin
Sustainable high-performance systems for structural bonding and FRP composites. Two-component and single-component formulations for industrial use.
Materials for Automotive Electronics & Power devices
Epoxy Potting
Advanced encapsulation resin for demanding electronic applications. Provides thermal, chemical, and mechanical protection for EV, industrial, and renewable systems.
Magnet Bonding Adhesives
Fast-curing adhesives for thermal and electronic performance. We support high-reliability bonding solutions for motors, sensors, and thermal modules in next-gen automotive systems.
Photolithography Processing Materials
High Resolution Dry Film Photoresist Negative Tone
Precision patterning material for advanced lithographic applications. Enables high-resolution imaging in semiconductor and MEMS fabrication using negative-tone photoresist films.
Polyimide Film
Polyimide Film (Xenomax®)
High-performance polyimide film for flexible electronics and next-generation displays. Delivers unmatched thermal and dimensional stability for demanding optical and sensor applications.
Quantum Dots Materials
Quantum Dots Materials
Next-generation patterning materials for ultra-high resolution MicroLED display technology. Delivering exceptional color purity, quantum efficiency, and Cd-free scalability for future displays.
Wafer Shipper
Horizontal Wafer Shipper
High-protection transport and storage solution for semiconductor wafers. Combines mechanical safety, optimized density, and ESD performance for cleanroom-compliant wafer logistics.
Vertical Wafer Shipper
Clean, compact, and secure transport solution for semiconductor wafers. Combines particle control, ergonomic handling, and cleanroom compatibility for efficient wafer logistics.
