Thermally Conductive Adhesives for Thermal Management
Nagase’s advanced adhesives combine strong bonding with optimal heat dissipation.
Designed for power electronics, LEDs, and thermal-critical assemblies.
High-Performance Adhesives for Heat-Sensitive Components
Nagase’s thermally conductive adhesives combine strong mechanical bonding with efficient thermal conductivity to support advanced heat management in electronic systems. Ideal for components such as LEDs, power transistors, and battery modules, these materials enable effective heat dissipation in compact, heat-sensitive environments. Thanks to low curing temperatures and fast processing times, they offer flexibility for automated assembly and thermal control in consumer electronics, automotive electronics, and industrial energy systems.
As a trusted partner in electronic materials, NAGASE supplies thermally conductive adhesives worldwide with application-specific guidance for performance-driven thermal management.
Applications
NAGASE’s thermally conductive adhesives are used to enhance heat transfer and mechanical stability in high-performance electronics.
- Power modules – Improve thermal interface performance between die and heatsink
- LED assemblies – Reliable bonding of light-emitting components with effective heat spreading
- Battery packs – Enable thermal coupling between battery cells and casing
- Optical devices – Maintain temperature stability in precision optical systems
Features
NAGASE’s thermally conductive adhesives combine cost-efficiency, processability, and thermal performance for scalable integration.
- Cost-efficient – Designed for economical use in large-scale manufacturing
- Low-viscosity blend – Ensures easy handling and uniform material distribution
- Low-temperature curing – Compatible with heat-sensitive components and substrates
- Fast curing – Supports efficient processing and reduced production cycle times
- Customization possible
Additional Information
- Meets the requirements of RoHS and EU REACH