Liquid Molding Compound (LMC)

Advanced encapsulation materials for semiconductors and electronic components.
 Ideal for ICs, sensors, MEMS, and power devices in demanding packaging applications.

Reliable Encapsulation Resin for ICs, Sensors, MEMS, and Power Devices

NAGASE’s range of semiconductor encapsulants includes Liquid Molding Compounds (LMC), Sheet Molding Compounds (SMC), and Underfill materials. These high-performance resins provide mechanical protection, electrical insulation, and thermal stability for integrated circuits (ICs), sensors, MEMS, power devices, and more.

Formulated for precise flow, fast curing, and minimal shrinkage, these encapsulants enhance device reliability in harsh environments, including automotive, industrial, and consumer electronics.

NAGASE offers custom-engineered encapsulation solutions to meet diverse packaging needs in global semiconductor manufacturing.

Applications

Liquid Molding Compound and related materials are used for high-reliability encapsulation in semiconductor and electronic device packaging.

  • Encapsulation of ICs, sensors, and MEMS
  • Protection of power semiconductor devices
  • Underfill applications for flip-chip assemblies
  • Sheet molding compound for larger electronic modules
  • Electronics used in automotive, industrial, and consumer devices

Features

Liquid and sheet molding compounds from NAGASE deliver reliable protection, high processability, and excellent thermal and electrical properties for semiconductor packaging.

  • Excellent encapsulation performance – Reliable protection for sensitive components
  • High thermal stability – Suitable for power electronics and automotive use
  • Low shrinkage and stress – Maintains structural integrity post-cure
  • Precise flow and fast curing – Optimized for high-throughput production
  • Custom formulations available – Tailored to device type and packaging method
  • High thermal conductive liquid molding compound for power application

Additional Information

  • Liquid at room temperature and dust-free suitable for clean room environment
  • The ability to cure at lower temperatures in the range of 110-125 °C
  • Extremely low warpage and low thermal strain on devices
  • Meets the requirements of RoHS and EU REACH

Frequently Asked Questions about Liquid Molding Compound (LMC)

What are Liquid Molding Compounds (LMC) used for in semiconductor packaging?
LMCs are used to encapsulate and protect ICs, MEMS, and sensors against moisture, heat, and mechanical damage.

How do LMC and SMC differ in semiconductor applications?
LMCs are flowable and used for smaller components, while SMCs are ideal for larger electronic modules and high-pressure molding.

What are Underfill materials used for?
Underfill compounds fill the gap between die and substrate in flip-chip packaging to enhance mechanical strength and thermal cycling resistance.

Can these encapsulants handle automotive-grade reliability requirements?
Yes, NAGASE’s encapsulants are formulated to meet the stringent demands of automotive and power semiconductor applications.

What customization options are available for encapsulants?
NAGASE offers custom-modified formulations with adjusted viscosity, cure time, thermal expansion, and filler content to match specific packaging processes.

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Electronics

Yenn Leng Tan
Sales Manager