Epoxy Potting Material
Advanced encapsulation resin for demanding electronic applications.
Provides thermal, chemical, and mechanical protection for EV, industrial, and renewable systems.
High-Performance Encapsulation for Harsh and High-Temperature Environments
Epoxy potting material is a high-performance resin system designed to encapsulate and protect sensitive electronic assemblies from moisture, dust, corrosive chemicals, and thermal or mechanical stress. It plays a critical role in ensuring long-term reliability and environmental resistance for a wide range of devices — from power electronics in electric vehicles to solar inverters and consumer-grade LED drivers.
Offering excellent thermal stability, low coefficient of thermal expansion (CTE), and customizable properties such as viscosity and cure time, this material enables precise adaptation to varying application requirements and regulatory standards like UL V-0 flammability.
NAGASE supplies advanced epoxy potting materials tailored for demanding applications in EV systems, industrial automation, and renewable energy sectors – with full support for global logistics, compliance, and performance optimization.
Applications
Epoxy potting material is used across multiple industries for encapsulating and protecting electronic devices.
- Electric Vehicles (EVs) – Power inverters, battery systems, and motor controllers
- Renewable energy – Solar inverters, wind turbine converters, and energy storage
- Industrial electronics – Automation systems, drives, and power supplies
- Consumer electronics – Chargers, LED drivers, and adapters
Features
Epoxy potting material provides thermal stability, chemical resistance, and formulation flexibility for advanced electronic protection.
- Thermal stability – Maintains performance under high or fluctuating temperatures
- Low CTE – Reduces stress during thermal cycling to prevent component damage
- Chemical resistance – Shields against moisture, solvents, and corrosive agents
- High adhesion – Adheres well to complex substrates and interconnects
- Customizable formulations – Tunable viscosity, curing profiles, and mechanical strength
- UL V-0 flammability – Meets fire safety standards for 3.2mm and 1.6mm layers
Additional Information
Why Choose Nagase’s Epoxy Potting Materials?
- Proven Expertise:
Decades of experience in developing advanced materials for electronics and power modules. - Custom Solutions:
Ability to tailor formulations to meet specific thermal, mechanical, and electrical requirements. - Global Support:
Technical expertise and customer service available worldwide to ensure seamless integration and optimal performance. - Sustainability:
Environmentally friendly formulations designed to meet industry regulations and reduce environmental impact. - Meets the requirements of RoHS and EU REACH.
Advantage
Technical Highlights:
- Thermal Conductivity:
Up to 2.5 W/m·K (customizable for higher requirements). - Operating Temperature Range:
Outstanding heat resistance with Tg > 210°C. - Cure Time:
2 step fast-cure formulations available for high-volume production. - Certifications:
Compliant with RoHS, REACH, and UL standards.
