Electrically Conductive Adhesives for Advanced Electronics
Reliable bonding meets precise conductivity.
Nagase offers cutting-edge adhesive solutions tailored for modern electronic components and assemblies.
High-Performance Adhesives for Sensitive Electronic Interfaces
Nagase’s electrically conductive adhesives are engineered to deliver strong adhesion combined with stable electrical conductivity. These advanced materials enable reliable connections in areas where conventional soldering is impractical—such as on delicate flex circuits, heat-sensitive components, or highly miniaturized electronic assemblies. Designed for demanding use in consumer electronics, automotive systems, and medical devices, our conductive adhesives support high-integration designs with excellent processability, thermal stability, and long-term durability.
As a global partner to the electronics industry, NAGASE supplies electrically conductive adhesives with tailored support for next-generation applications in advanced manufacturing environments.
Applications
Electrically conductive adhesives from NAGASE are used in precision electronics where stable conductivity and strong bonding are critical.
- Solar modules – Reliable bonding for photovoltaic cells and components
- Optoelectronic packaging – Ideal for LED, photodiode (PD), VCSEL, and other light-based systems
- Miniaturized electronics – Suitable for precision applications in compact devices
Features
NAGASE’s conductive adhesives combine electrical reliability with process versatility for high-performance assembly applications.
- Stable electrical conductivity across a wide range of temperatures and substrates
- Excellent adhesion to flexible circuits, metals, and delicate electronic components
- Low-temperature curing options for heat-sensitive devices and materials
- Fine-pattern compatibility for miniaturized and high-density designs
- Reliable aging and moisture resistance for long-term durability
Additional Information
- Cost-efficient – Designed for economical large-scale applications
- Low viscosity blend – Ensures easy handling and uniform application
- Low-temperature curing – Compatible with heat-sensitive components
- Fast curing – Enables efficient processing and reduced cycle times
- Meets the requirements of RoHS and EU REACH