Advanced Sheet Molding Compound (a-SMC)
High-performance thermoset compound for electronic encapsulation.
Enables robust protection of ICs, sensors, and power devices in semiconductor packaging.
Thermoset Sheet Material for Robust Semiconductor Encapsulation
Advanced Sheet Molding Compound (a-SMC) is a pre-formed thermoset resin reinforced with fillers and fibers, designed for high-reliability encapsulation of semiconductors. It provides mechanical strength, thermal stability, and environmental protection for ICs, sensors, MEMS, and power semiconductor devices.
Its sheet format enables consistent volume, fast press molding, and excellent flow into complex mold geometries, making it ideal for automotive and industrial electronics.
NAGASE supplies customized a-SMC formulations tailored to advanced semiconductor and power electronics encapsulation requirements worldwide.
Applications
a-SMC is used for high-strength encapsulation of semiconductor and electronic components in various industries.
- Encapsulation of ICs, sensors, and MEMS
- Packaging of power semiconductor devices
- Use in automotive electronics and engine control units (ECUs)
- Industrial control systems and power modules
- Application in consumer electronics requiring structural protection
Features
a-SMC delivers robust mechanical protection, thermal resistance, and reliable molding performance for semiconductor encapsulation.
- High mechanical strength – Reinforced for structural reliability
- Excellent thermal stability – Withstands harsh operating environments
- Preformed sheet format – Easy handling and volume control
- Excellent mold flow – Suitable for detailed mold geometries
- Customizable formulations – Tuned for semiconductor packaging needs
Additional Information
- Large area thin & homogeneous molding
- Encapsulating hollow packages/devices
- High thermal conductivity >10W/mK
- Meets the requirements of RoHS and EU REACH