Underfill Materials for Flip-Chip & BGA Packaging Archive - NAGASE

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MPC-Polymer

Synthetic, water-soluble polymer with exceptional biocompatibility. Optimized for IVD and assay reagent formulations in modern diagnostics.

Epoxy Potting

Advanced encapsulation resin for demanding electronic applications. Provides thermal, chemical, and mechanical protection for EV, industrial, and renewable systems.

Anti-Aging – AA2G™

Stabilized vitamin C derivative for brighter, healthier skin.
AA2G™ delivers long-lasting antioxidant and anti-aging benefits with enzymatic activation in the skin.

Nano Composite Insulation Material

Multi-layered metallic film with high-gloss appearance for automotive trim. Enhances exterior aesthetics with durable, lightweight and flexible molding solutions.
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Industries
Industries
Agriculture
Chemical
Electronics
Food Processing
In Vitro Diagnostics
Mobility
Paint & Coatings
Personal Care
Pharmaceutical
Plastic and Compounds
Printing
Featured Products
MPC-Polymer

Synthetic, water-soluble polymer with exceptional biocompatibility. Optimized for IVD and assay reagent formulations in modern diagnostics.

Epoxy Potting

Advanced encapsulation resin for demanding electronic applications. Provides thermal, chemical, and mechanical protection for EV, industrial, and renewable systems.

Anti-Aging – AA2G™

Stabilized vitamin C derivative for brighter, healthier skin.
AA2G™ delivers long-lasting antioxidant and anti-aging benefits with enzymatic activation in the skin.

Nano Composite Insulation Material

Multi-layered metallic film with high-gloss appearance for automotive trim. Enhances exterior aesthetics with durable, lightweight and flexible molding solutions.
Products
Company
Contact

Underfill material by Nagase for reliable chip and PCB bonding, designed to enhance electronic assembly durability and protect against thermal stress.

Underfill Materials for Flip-Chip & BGA Packaging

admin2026-02-18T10:33:32+00:00

Reinforcement and stress relief for advanced semiconductor packaging. Ideal for flip-chip, BGA, and high-reliability applications in microelectronics.

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NAGASE (EUROPA) GmbH
Werdener Straße 4
40227 Düsseldorf, Germany
Phone: 0049 (0)211 86620 0
E-Mail: service@nagase.de

INDUSTRIES

Mobility
Electronics
Chemicals
Paint and Coatings
Plastics and Compounds

Printing
Food Processing
Personal Care
In Vitro Diagnostics
Pharmaceutical

ISO, LEGAL & TAX DOCUMENTS