Metal Film Frame for Precision Wafer Dicing Processes

The Metal Film Frame is a precision-engineered stainless steel frame developed for semiconductor backend dicing processes, supporting stable wafer handling, film mounting, and precision cutting operations. Designed for high-volume manufacturing environments, the frame provides excellent dimensional stability and mechanical rigidity to ensure reliable process consistency during wafer singulation and backend assembly.

Manufactured from durable 420J2 stainless steel, the frame offers high strength, low deformation behavior, and excellent surface quality for contamination-sensitive semiconductor applications. Available in 6-inch, 8-inch, and 12-inch formats, it is compatible with a wide range of semiconductor equipment platforms and process flows.

Strict quality inspection standards ensure low warpage, controlled surface conditions, and stable dimensional accuracy required for advanced semiconductor manufacturing. The frame is optimized for cleanroom production environments where reliability, repeatability, and contamination control are critical.

NAGASE supplies high-quality Metal Film Frames for global semiconductor backend manufacturing applications, supported by technical expertise, international logistics capabilities, and reliable quality control standards.

The Metal Film Frame is primarily used in semiconductor backend wafer handling and precision dicing applications.

• Wafer dicing processes for semiconductor backend production
• Film mounting and wafer support during singulation
• Semiconductor packaging and assembly operations
• Precision wafer handling in cleanroom manufacturing environments
• Integration into 12-inch semiconductor equipment platforms

The Metal Film Frame provides high rigidity, low warpage, and stable dimensional accuracy for advanced semiconductor dicing operations.

• 420J2 stainless steel construction – Excellent durability and rigidity
• Low warpage design – Supports stable and precise wafer processing
• High dimensional accuracy for repeatable backend operations
• Controlled surface quality – Minimizes contamination and defects
• Semiconductor-grade quality control with full inspection standards

What is a Metal Film Frame used for in semiconductor manufacturing?
The Metal Film Frame is used to support wafers during backend semiconductor processes such as film mounting, wafer handling, and precision dicing operations.

Why is low warpage important for wafer dicing frames?
Low warpage helps maintain stable wafer positioning and process consistency during cutting, reducing the risk of alignment errors and wafer damage.

Which material is used for the Metal Film Frame?
The frame is manufactured from 420J2 stainless steel, providing high rigidity, dimensional stability, and durability for semiconductor production environments.

What wafer sizes are supported by the Metal Film Frame?
The Metal Film Frame is available in 6-inch, 8-inch, and 12-inch formats to support a wide range of semiconductor backend applications and equipment platforms.

How is the Metal Film Frame quality controlled?
Each frame undergoes strict dimensional inspection, surface quality control, and defect verification to ensure compliance with semiconductor manufacturing requirements.