Trimethyl Phosphite (TMP)

High-purity phosphorus precursor for PSG and BPSG layer formation.
Enables controlled doping and dielectric deposition in advanced semiconductor manufacturing.

Phosphorus-Rich Precursor for Uniform Glass Layer Deposition

Trimethyl Phosphite (TMP) is a high-purity phosphorus source used in the formation of phospho-silicate glass (PSG) and boro-phospho-silicate glass (BPSG) layers. These layers are deposited during wafer fabrication to serve as dielectric insulators and stress-relief layers in semiconductor devices.

With excellent volatility and controlled decomposition behavior, TMP is well-suited for chemical vapor deposition (CVD) and related processes, supporting uniform phosphorus incorporation in integrated circuits, discrete devices, and MEMS components.

NAGASE supplies Trimethyl Phosphite in electronic-grade quality for global semiconductor and microelectronics manufacturing – supported by expert logistics and technical service.

Chemical Formula: P(OCH3)3          

Molecular Weight: 124.08

Physical & Chemical Properties

A colorless liquid with pungent odor.

Melting Point: -78 ℃
Boiling Point: 111 to 112 ℃
Density: 1.05 g/mL

Flammable. Insoluble in water. Slowly hydrolyzed into Phosphoric Acid and Methanol when it contacts with water.

Applications

Trimethyl Phosphite is mainly used for PSG and BPSG deposition in semiconductor wafer processing.

  • Deposition of PSG and BPSG dielectric layers
  • Wafer fabrication for IC and chip production
  • Semiconductor manufacturing involving phosphorus doping
  • Production of MEMS and microcomponents
  • Processing of discrete devices

Features

Trimethyl Phosphite provides high phosphorus content, reliable volatility, and compatibility with vapor-phase deposition methods for dielectric applications.

  • High-purity phosphorus precursor – Suitable for PSG and BPSG formation
  • Low metal impurities to meet semiconductor-grade standards
  • Consistent volatility – Ideal for controlled deposition conditions
  • CVD-process compatibility – Enables uniform phosphorus distribution
  • Globally available – Supplied by NAGASE with full technical support

Product Specification

Product 8.5N
Purity (based on metals analyzed), min 99.9999995%
（Al）max 0.7 ppb （Pt）max 0.05 ppb
（Sb）max 0.05 ppb （K）max 0.3 ppb
（As）max 0.5 ppb （Re）max 0.05 ppb
（Ba）max 0.05 ppb （Rh）max 0.05 ppb
（Be）max 0.1 ppb （Rb）max 0.05 ppb
（Bi）max 0.05 ppb （Ag）max 0.3 ppb
（Cd）max 0.1ppb （Na) max 1 ppb
（Ca）max 1 ppb （Sr）max 0.05 ppb
（Ce）max 0.05 ppb （Ta）max 0.05 ppb
（Cr）max 0.1 ppb （Tl）max 0.05 ppb
（Co）max 0.1 ppb （Th）max 0.1 ppb
（Cu）max 0.5 ppb （Sn）max 0.5 ppb
（Ga）max 0.05ppb （Ti）max 0.3 ppb
（Ge）max 0.05 ppb （W ）max 0.05 ppb
（Au）max 0.1 ppb （U ）max 0.1 ppb
（Hf）max 0.2 ppb （V ）max 0.05 ppb
（In）max 0.05 ppb （Zn）max 0.5 ppb
（Ir）max 0.05 ppb （Zr）max 0.1 ppb
（Fe）max 0.5 ppb （B ）max 50 ppb
（Pb）max 0.5 ppb Cl-max 50 ppb
（Li）max 0.1 ppb Water max 25 ppm
（Mg）max 0.2 ppb Particles ≥0.µm max 10 p/ml
（Mn）max 0.1 ppb Particles ≥0.3 µm max 7 p/ml
（Hg）max 0.2 ppb Particles ≥0.5 µm max 5 p/ml
（Mo）max 0.1 ppb Particles ≥1.0 µm max 1 p/ml
（Ni）max 0.5 ppb Chroma max 5APHA
（Nb）max 0.05 ppb Assay min 99.99 %
（Pd）max 0.05 ppb Shelf life 12 months

Packaging Size

Container: Stainless Steel Cylinder

Packaging: Stainless Steel Cabinet

Fill volume: 2 gallons, 5 gallons (19 L),10 gallons.

Frequently Asked Questions about Trimethyl Phosphite (TMP)

What is Trimethyl Phosphite (TMP) used for in semiconductor manufacturing?
TMP is primarily used as a phosphorus source for depositing PSG and BPSG layers on silicon wafers during wafer fabrication.

Why is TMP used for dielectric layer formation?
It enables precise phosphorus doping into glass layers, improving insulation, planarization, and mechanical stability in semiconductor devices.

How is TMP introduced in wafer processing?
TMP is typically used in chemical vapor deposition (CVD) and related gas-phase processes, where its volatility ensures uniform film formation.

Is TMP suitable for MEMS and discrete device applications?
Yes, TMP is used in the fabrication of MEMS and discrete components where boron- and phosphorus-doped glass layers are required.

What makes electronic-grade TMP suitable for critical applications?
Its high purity and controlled decomposition ensure reliable performance in sensitive microelectronics manufacturing environments.

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Electronics

Enes Islemecioglu
Sales Manager

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