Liquid Molding Compound
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We offer a variety of liquid molding compound for comporession molding. Suitable material can be selected for different types of semiconductor package.
Applications
Semiconductor (ICs, Sensors, MEMS, Power Devices, etc.)
Additional Information
Liquid Molding Compound
- Liquid at room temperature and dust-free suitable for clean room environment
- The ability to cure at lower temperatures in the range of 110-125 °C
- Extremely low warpage and low thermal strain on devices
Electronics
Yenn Leng Tan
Sales Manager